Event details
Date:
Thursday, April 23
Venue:
Hall 5, Shenzhen Convention & Exhibition Center (Futian), China

Bluetooth Innovator Stage


Thursday, April 23

MC: (TBC)


10:30-11:00

(TBC)

Teledyne LeCroy

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11:00-11:30

Channel Sounding and High Data Throughput: The New Pillars of Bluetooth Innovation

Franz Dugand, Product Marketing Senior Director of WIoT BU, Ceva

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11:30-12:00

Advancing Automotive PEPS with Bluetooth Channel Sounding for High Accuracy, Low Latency, and Power Efficient Vehicle Access Systems

Paul Daigle, Senior Product Marketing Manager, Wireless and Pasi Rahikkala, Senior Systems Engineer, Silicon Labs

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14:00-14:30

(TBC)

————————————————————————————————————————

14:30-15:00

(TBC)

————————————————————————————————————————

15:00-15:30

(TBC)



Friday, April 24

MC: (TBC)


10:30-11:00

Bluetooth and MATLAB: A Winning Combination

Vincent Chen, CES Industry Manager, MathWorks

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10:30-11:00

Multi-Node Bluetooth BLE 6.0 Channel Sounding: High-Precision Fusion Positioning Based on Phase Ranging

Brandon Chen, Digital Key Product Director, YFORE Technology Co., Ltd.

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11:30-12:00

Bluetooth® Communication Topology for Industrial IoT

Infineon

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14:00-14:30

(TBC)

————————————————————————————————————————

14:30-15:00

(TBC)

————————————————————————————————————————

15:00-15:30

(TBC)


*Note: The organizer reserves the right to change the schedule; the final schedule shall be subject to the one released on the event day.


Moderator
Market Development Manager for China & APAC, Bluetooth SIG
Speaker2026
2026 Exhibitors